Updates for Stackable PC/104 specification from PC104 Consortium

Hot news for PC104 designers and users! Here is a recent article on a fresh, effective and cost-efficient solution for PC/104 boards, called «OneBank». This additional option allows designers to free additional space on the PCI/104 boards, while remaining compatible with the various form-factors. Read more of the article, originally published by Jeff Milde, Executive Director of the PC/104 Consortium.

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Russian high tech at Hannover Messe 2015.

Fastwel participates in   Hannover Messe exhibition on 12-17th April 2015, this time as a part of iMoscow booth. There the most innovative, high-tech companies of Moscow come together, to demonstrate its core competencies. The aim of such a collaboration was to let visitors see for themselves that Russian companies provide modern high-tech solutions, competitive in the global markets.

Fastwel introduced its rugged customized Tablet PC  highly resistant to shocks and vibrations as well as industrial SBCs for mission critical applications.

Overall, the iMoscow residents’ products, such as super conductors, medical equipment, rugged electronics — attracted numerous visitors.

The future of industrial communications: Fieldbus or Ethernet?

Having recently joint Fastwel as a Head of European Branch, I’ve attended the first event in a new role. It was a workshop, organized by Telerex in Breda, the Netherlands, where over 40 industrial automation experts arrived to discuss the state of art in industrial communications. The experts talked about pros and cons of Fieldbuses and Ethernet communications for industrial automation. Many technical details of “Fieldbus VS Ethernet” battle have been covered; however, here I would like to focus on the business aspects of the problem. Continue reading

Intel Embedded and Communications Alliance (ECA) — Fastwel

Intel Embedded and Communications Alliance (ECA) — Fastwel

Intel Embedded and Communications Alliance (ECA)

 

Intel Embedded and Communications AllianceThe Intel® Embedded and Communications Alliance is a community of communications and embedded developers and solutions providers committed to the development of modular, standards-based solutions on Intel technologies.

Fastwel is a member of the The Intel® Embedded and Communications Alliance, a community of developers and solution providers utilizing Intel technology in the development and deployment of solutions. Continue reading

Fastwel CPC512 3U CompactPCI Ivy Bridge CPU Board

Fastwel CPC512 3U CompactPCI Ivy Bridge CPU Board

For real-time, automation control, high-speed data acquisition and processing systems

  • Intel IvyBridge (2/4 Cores)
  • RAM: DDR3 SDRAM 1333, 1600 MHz or DDR3L SDRAM 1066,
  • 1333 MHz with ECC up to 8GB soldered, 2-channel
  • FRAM: 32x KB, 1 KB of which represent a closed area for storing Bios Setup settings; implemented on SPI FPGA bus
  • FLASH BIOS: 2 х 32 Mbit SPI-Flash
  • Power supply: Supply voltage: +12V, +5V_STBY (optional)
  • Operating temperature range: –40…+85°С (according to IEC 60068-2-14)
  • Single/Multiple shock resistance:
  • 100g (according to IEC 60068-2-27) /50g (IEC 60068-2-29)
  • Supported OS: Windows 7 Embedded, Linux 2.6, QNX 6.5.0

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PICMG Open Modular Computing Standards CompactPCI Overview

PICMG Open Modular Computing Standards CompactPCI Overview

The CompactPCI® family of specifications define a low cost,
modular, and scalable approach to building systems suitable for an extremely wide range of industrial, commercial, aerospace, military, instrumentation, data acquisition, communications, telephony, machine control, and man machine interface applications.

CompactPCI, first introduced in 1999, has continued to evolve new applications – including the two main computers on the Mars Rover, Curiosity.

CompactPCI’s success is due in no small part to its adoption of the parallel PCI bus as the main data bus. PCI was the first universal, processor-independent computer bus that was adopted by all major microprocessor manufacturers. Hundreds of processors chipsets and thousands of peripheral chips utilize PCI.  By leveraging low cost silicon and software developed for PCI, CompactPCI has become the world’s most popular modular open computer architecture designed for embedded applications.

The PICMG 2.16 version of CompactPCI defined the industry’s first switched fabric Ethernet backplane architecture that allowed more than a dozen processor boards to be interconnected as a local high speed  LAN in a single chassis.

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Fastwel CPC510 3U CompactPCI Ivy Bridge i7 Board

Fastwel CPC510 3U CompactPCI Ivy Bridge i7 Board

  • Intel IvyBridge processors (2/4 Cores, up to 2,5 GHz)
  • Up to 8 GB soldered, dual_channel DDR3 SDRAM with ECC
  • 2 DisplayPort up to 2560х1600@60Hz at the front panel, 1 DisplayPort up to 2560х1600@60Hz is routed to the mezzanine module
  • 2xGigabit Ethernet ports (front panel)
  • 2xUSB 2.0 (front panel)
  • Intermodule communication (PICMG CPCI_S.0 CompactPCI® Serial): two x8 FatPipe PCI_E 2.0; four x4 PCI_E 2.0; 8 USB2.0 or 4 USB2.0 + 4 USB3.0; 2 SATA II and 2 SATA III
  • SD card slot with USB 2.0 interface
  • Increased heatsink versions for passive cooling
  • Protective coating (optional)
  • –40…+85°С or 0…+70°C (IEC 68-2-14-84)
  • Windows 7 Embedded, Linux 2.6, QNX 6.5

Fastwel CPC510 is a highly integrated 3U CPCI Serial solution for using in real time systems, manufacturing control, high-speed collection and processing of data. СРС510 is another product in the range of 3U CPCI modules manufactured by Fastwel Group.

The board is based on the Intel Ivy Bridge CPU (2- or 4-core CPUs) which has one of the highest performances in its class.

CPC510 uses high speed I/O interfaces (PCI-Express, Gigabit Ethernet) and modern technologies for video data processing. Modular structure of the device enables a flexible setting of the system for particular fields, which optimizes a price-quality relationship.

To expand CPC510 functionalities, MIC584 mezzanine module is used. Its detailed description is given in the User Manual.

Stable operation of CPC510 enables its use in all industrial applications. Components, on which CPC510 is based, are carefully selected in accordance with the embedded system applicability criteria which make the module perfectly fit for the long life cycle systems.

The module has the following structure of I/O channels:

— 2 GB/s Ethernet controllers (2x routed to the front panel);

— 12x USB 2.0 ports supporting HS, FS and LS data rates (2x on the front panel, 2x on the mezzanine, 8x on the backplane connector);

— 4x USB 3.0 ports (routed to the backplane connector)

— 6x SATA ports (4x ports are routed to the backplane connector, 1x — to the mezzanine board, 1 – switchable: backplane/mezzanine board)

— 1x DisplayPort, routed to MIC590 board (to the front panel of CPC510-02)

— 1x LVDS, routed to MIC590 board

— 2x DisplayPorts on the front panel.

— HD Audio, routed to the mezzanine connector.

— LPC, routed to the mezzanine connector.

 

https://www.prosoft.ru/cms/f/455616.pdf

ELMA CPCI Type 39C 4U 19″ Rackmount Enclosure Chassis Platform

ELMA CPCI Type 39C 4U 19″ Rackmount Enclosure Chassis Platform

The Elma Type 39C, 4U is a advanced generation of CompactPCI enclosures for PICMG 2.0, 2.16, 2.17, and EXP.0 applications. This enclosure optimized design addresses EMC, cooling, and ease of manufacturing, in a highly attractive, cost effective package. The black powder coated platforms are available in rackmount or desktop versions. The unit is fully compliant to IEEE 1101.10/11 specifications with horizontal mounting for 6U x 160mm CPCI cards from the front and 6U x 80mm I/O cards from the rear. The platform is designed to hold a wide variety of storage devices depending on the configurations. The unit is thermal engineered for superior cooling with front-to-rear or side-to-side airflow, considering card, device and power supply requirements. The unit holds a 8 slot CPCI backplane. Plug-in power supplies are standard. The platform meets the strict requirements of CE, FCC Class A and NEBS.

Features

  • 19” Rackmount/Desktop fully compliant to Eurocard, IEEE 1101.10/11, and PICMG 2.0
  • 4U x 84HP x 290mm (H x W x D)
  • 6U horizontal card mounting
  • 8 slot PICMG: 2.0, 2.16, 2.17 backplane options
  • Advanced EMC shielding to meet CE, FCC, and NEBS
  • Cooling side to side
  • Pluggable PSU
  • Ready to run — turnkey solution

Scope of Supply

High quality platform consisting of black painted sheet steel enclosure, high performance PICMG 2.0 backplane, pluggable power supply, cooling system and AC/DC power components. Assembled, wired and tested prior to shipment.