Consortiums & Alliances

PC 104

The PC/104 Consortium is an international organization of manufacturers of PC/104 products that maintains the PC/104 specifications, disseminates PC/104 technology, and promotes the welfare of its members. The Consortium is one of the most active and effective associations in the electronics industry, and as a result of its many activities, PC/104 is accepted as a significant emerging standard in the embedded-computer electronics industry.

PICMG (PCI Industrial Computer Manufacturers Group)

is a consortium of over 450 companies who collaboratively develop open specifications for high performance telecommunications and industrial computing applications. PICMG specifications include CompactPCI® for Eurocard, rackmount applications and PCI/ISA for passive backplane, standard format cards.

VITA, the VMEbus International Trade Association

is an incorporated, non-profit organization of vendors and users having a common market interest. VITA's mission includes not only promoting VMEbus, but promoting the very concept of open technology as embodied in the many standards currently under development within the VITA Standards Organization.

The OPC Foundation

is dedicated to ensuring interoperability in automation by creating and maintaining open specifications that standardize the communication of acquired process data, alarm and event records, historical data, and batch data to multi-vendor enterprise systems and between production devices including sensors, instruments, PLCs, RTUs, DCSs, HMIs, historians, trending subsystems, alarm subsystems, and more as used in the process industry, manufacturing, and in acquiring and transporting oil, gas, and minerals.

The Intel Communications Alliance

is a community of communications and embedded developers and solutions providers committed to the development of modular, standard-based solutions based on Intel technologies.

CAN in Automation (CiA)

is the international users’ and manufacturers’ organization that develops and supports CAN-based higher-layer protocols. All activities are based on CiA members’ interest, participation and initiative. CiA representatives actively support international standardization of CAN protocols and represent the members’ interest in national and international standardization committees, such as ISO and IEC. CiA members initiate and develop specifications that are then published as CiA standards. These specifications cover physical layer definitions as well as application layer and device profile descriptions. Fastwel was honored to join the association and has become its active participant.

The EtherCAT Technology Group (ETG)

is the forum in which key user companies from various industries and leading automation suppliers join forces to support, promote and advance the EtherCAT technology. EtherCAT Technology Group aims to ensure the compatibility of EtherCAT implementations by defining functional requirements, conformance tests as well as certification procedures. ETG's goal is to ensure that EtherCAT technology meets and exceeds the requirements of the widest possible application range. In order to accomplish this goal the group combines leading control and application experts from machine builders, system integrators, end users and automation suppliers to provide both qualified feedback about application of the existing technology and proposals for future extensions of the specification.

StackPC – New Standard of Embedded Stackable Systems Design

The StackPC Specification defines new approach to stackable systems design and development. The specification includes all valuable heritage of PC/104 standards along with the new features of StackPC connector. The main competitive distinction of the StackPC connector is the combination of most popular low speed interfaces such as USB, COM, CAN, SPI, LPC and high speed SATA, Gigabit Ethernet and PCI-Express x1, x4 within one stack expansion connector. This combination allows to minimize the number of wired connections inside the stack system enclosure and gives more design and manufacturing flexibility.