Conduction Cooled Systems

Conduction Cooled Systems

Custom design of each system based on common approaches of appropriate standard, used for rugged flexible solutions (IP65-67), allows using high performance modules in systems that maintain reliability at high operating temperatures (up to 70ºC).

COM Express               PC/104-plus                     StackPC-PCI           CPCI Serial

     

Target application

-40/+70 ºС

EN50155, EN60068

10/100/150g Vibration/Shock

EN61373

IP65-67, IK08-IK10

IEC60529, EN62262

Salt mist

EN60068

Damp Heat

EN60068

EMC
(Electromagnetic compatibility)

IEC61000


Choose your form factor

COMPACT PCI
SERIAL
STACKABLE PC
StackPC
PICMG CPCI-S Standard
picmg.org
StackPC Standard
www.stackpc.org


CPCIs PICMG

Conduction Cooled Assembly (CCA)

CCA FRAME (1st Part of CCA assembly)

  • Front board cassette dimensions which cover PCB
  • Card retainer (Wedge Locks)
  • Ejectors
  • Board pitch 5HP

CCA ENCLOSURE (2nd Part of CCA assembly)

  • Card retainer channel width
  • Backplane position
  • Board Pitch 5HP
       

CCA Enclosure

Enclosure surface works as system heatspreader

CCA frame surface works as module heatspreader

CCA ENCLOSURE DEFINES:

  • Card retainer channel width
  • Backplane position
  • Board pitch 5HP
  • Usually custom design according to customer system requirements

CPCI-Serial Modules

Each CPCI module has one or few hot components that should fit CCA frame


Main idea is to dissipate power along the frame to it’s edges


Main difficulty to provide good cooling solution is chips tolerances

Each chip has it’s surface roughness and flatness


Fastwel modules has adjustable heatspreader part with heat pipes inside for high performance modules

Heat Dissipation Model

CPC510 HEAT DESSIPATION RESEARCH – HEATSPREADER FIT

What happens if heatspreader fits CPU chip only by 2/3 of its square?







Conduction Cooled Solutions

Host CPU and Power modules:

  • One way stack only (StackUP)
  • Bottom side for Heatspreader
  • Bottom side for hot and high components
  • Mass production modules adaptation
  • Cost effective solution



Heatplate provides path for power dissipating along Heatplate to it’s edges and then to enclosure

 


Expansion modules:

  • Regular modules dimensions like PC104
  • Top side for Heatspreader
  • Top side for hot components
  • Mass production modules adaptation
  • Cost effective solution


Stack with conduction cooling:

  • Regular Stack – any position of stack inside the enclosure
  • Regular modules – availability of adding regular modules without heatplates to conduction cooled stack
  • Modules with conduction cooling – common approaches for adding heatplates to Power, CPU and Peripheral modules
  • Common Heat plates – the same heatplate shape and fix method
  • Flexibility – all stackable modules benefits with conduction cooling feature
  • Easy to manufacture – just screw wedge locks, easy access to I/O connectors, easy maintenance



Conduction-Cooled Stack

Off-the-shelf modules application for conduction cooling



System example with conduction cooling


Heat Dissipation Version

System example with conduction cooling



System Implementation

System example with conduction cooling:

  • Regular stack
  • Regular modules
  • Modules with conduction cooling
  • Common heatplates
  • Flexibility
  • Easy to manufacture
CPC309 CPC309+Conduction Cooling MK300


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