- Form-factor: 3U CompactPCI Serial, 4HP;
- System Bus: PCIe x8 Gen3;
- RAM: 2 x channels 4GB each;
- Power supply:12 V +/-10%;
- High Density Connector for Mezzanine Module with support
of a full set of pins (HPC);
- Operating temperature range: from -40 to +85°С;
- Dimensions: no more than (130.6±0.4) × (212.4±1.6) × (21.3
±0.5) mm;
- Weight: no more than 0.62 kg;
- MTBF: min. 100,000 hours.
3U CompactPCI Serial Computation Module, main computing resource – FPGA XCKU060-2FFVA1517I, conformal coating\Coated
3U CompactPCI Serial Computation Module, main computing resource – FPGA XCKU115-2FLVA1517I. , conformal coating\Coated